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Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference

05/13/2026 | Indium Corporation
As a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.

Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026

05/01/2026 | Indium Corporation
As a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.

Indium to Present High-Performance AI Application Solutions at SEMICON SEA 2026

05/01/2026 | Indium Corporation
As a leading provider of advanced materials solutions enabling today’s demanding AI applications, Indium Corporation® experts will share their technical insight and knowledge on two industry-critical topics at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.

Indium Awarded $3.2 Million DOE Grant to Establish Domestic Gallium Supply Chain

04/28/2026 | Indium Corporation
Indium Corporation announced it has been awarded a $3.2 million grant by the U.S. Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation (CMEI) to develop a domestic process for recovering high-purity gallium from manufacturing by-products—a critical step toward establishing a secure, domestic supply chain for a material essential to modern defense systems, semiconductors, and advanced electronics.

Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS

04/15/2026 | Indium Corporation
Indium Corporation Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages.
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