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EMAC Returns with Bright Electronics Manufacturing Challenge 2026

04/30/2026 | SMTA
The Electronics Manufacturing & Assembly Collaborative (EMAC) has announced the return of the Bright Electronics Manufacturing Challenge 2026, an immersive, hands-on student competition that puts real electronics manufacturing experience into the hands of the next generation of engineers.

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Zhen Ding, Tsinghua University Launch Phase II R&D and Digital Transformation Program

04/30/2026 | Zhen Ding
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From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation

04/30/2026 | I-Connect007
I-Connect007 wraps up its six-part podcast series, PCB Materials: The Backbone and Future of Electronics, with Episode 6 and a discussion focusing on innovation. In Episode 6, Marcy LaRont speaks with Isola CTO Kirk Thompson about a critical turning point for the PCB industry as innovation accelerates. As data rates climb and demands from AI infrastructure, power density, flexible electronics, photonics, and chiplet integration intensify, traditional material assumptions are no longer sufficient.
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