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Advanced Electronics Packaging Digest

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Astro Digital Selects Everspin 64Mb STT-MRAM for GEO Satellite

07/29/2026 | BUSINESS WIRE
Everspin Technologies, Inc., the world's leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) solutions, announced that Astro Digital has selected Everspin’s PERSYST 64Mb STT-MRAM for use on an upcoming Raven bus geosynchronous Earth orbit (GEO) satellite mission.

Micron Strengthens Automotive Ecosystem Supply Through Strategic Customer Agreements

07/17/2026 | Micron
Micron Technology, Inc. has completed Strategic Customer Agreements (SCAs) with key Tier 1 suppliers and ecosystem partners supporting the global automotive industry and automotive manufacturers.

Power and Thermal Constraints in AI Accelerator Packages

07/17/2026 | Chetan Arvind Patil, Marvell Technology
For more than five decades, semiconductor progress was driven primarily by transistor scaling. Moore's Law provided a predictable path for increasing transistor density, while process technology advancements consistently improved performance, power efficiency, and manufacturing cost. During this period, package development evolved alongside silicon, supporting higher pin counts, faster interfaces, and improved thermal performance, but it rarely dictated overall system capability.

Micron Accelerates U.S. Investments, Pours First Concrete at New York Fab

07/12/2026 | Micron
Micron Technology, Inc.  announced it is accelerating its planned U.S. fab and technology investments and increasing its expected spend to more than $250 billion through 2035, driven by surging demand for memory in the AI era.

Server DRAM Contract Prices to Rise 13-18% QoQ in 3Q26 Amid Long-Term Price Caps

07/09/2026 | TrendForce
TrendForce’s latest memory pricing survey indicates that multiple memory suppliers have already factored in expected price hikes into their prices for the second quarter of 2026.
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