The Test Connection, Inc. Adds Experienced Test Engineer to Expand Flying Probe and ICT Capabilities
May 6, 2026 | The Training Connection LLCEstimated reading time: 2 minutes
The Training Connection LLC (TTC-LLC) has hired Hermes Gonzalez as a Test Development Engineer, adding deep experience in flying probe and in-circuit test (ICT) to its engineering team.
In this role, Gonzalez will focus on test development for flying probe platforms, including the Seica Pilot V8, as well as ICT development on the Keysight 3070. His addition supports TTCI’s ongoing work in delivering test solutions for complex, high-reliability electronics.
Gonzalez brings more than 15 years of experience in test engineering, with a background that spans aerospace, defense, and high-performance electronics. He has led test development efforts for complex RF PCBAs, supporting new product introduction (NPI), production ramp, and continuous improvement initiatives. His work has included developing flying probe test programs, implementing ICT systems, and working closely with design teams to improve test coverage and manufacturability.
Prior to joining TTCI, Gonzalez held senior test engineering roles at companies including BAE Systems and CesiumAstro, where he was responsible for deploying and optimizing test platforms such as flying probe systems and Keysight 3070 ICT. His experience includes debugging complex circuit failures to the component level, improving test efficiency, and reducing false failures in production environments.
“Hermes brings a strong mix of hands-on test development and real-world production experience,” said Bert Horner, President of TTCI. “He understands how to build test solutions that not only work in development, but hold up in production.”
TTCI specializes in electronic test engineering services, including in-circuit test (ICT), flying probe test (FPT), boundary scan (JTAG), functional test development, and design for test (DfT). By adding Gonzalez to the team, the company further strengthens its ability to support customers with complex assemblies, faster program ramp-up, and improved test coverage.
With growing demand for flexible and scalable test solutions, Gonzalez’s experience in both flying probe and ICT platforms will help TTCI continue to support customers across aerospace, defense, medical, and other high-reliability markets.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
Nordson Test & Inspection Partners with Quiptech Mexico to Expand Market Presence
05/05/2026 | Nordson Test & InspectionNordson Test & Inspection, a global leader in test, inspection and metrology solutions for semiconductor and SMT markets, announced a strategic partnership with Quiptech Mexico (a trading name of QTEK Mexico).
EMI Strengthens Test Capability with Acculogic Flying Probe System
05/04/2026 | Express Manufacturing, Inc.Express Manufacturing, Inc. (EMI), a global electronics manufacturing services (EMS) provider, has added the Acculogic Scorpion 980E Flying Probe Test System to its inspection and test operations, giving the company greater flexibility in how it validates and supports today’s increasingly complex electronics.
NASA Fires Up Powerful Lithium-Fed Thruster for Trips to Mars
05/04/2026 | NASA JPLA novel electromagnetic thruster passed an initial test in a specialized chamber at JPL. With further development, these thrusters could support human missions to the Red Planet.
JAVAD EMS to Add New ESPEC Temperature Chamber to Support Growing Mil/Aero Work
04/28/2026 | JAVAD EMSJAVAD EMS (JEMS), a leading global EMS company that provides low to medium volume, high-mix applications, has ordered a new ESPEC EGNZ28-15NW temperature cycling chamber to expand its environmental testing capabilities as demand continues to grow in the military and aerospace sectors.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?