Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

AI Server Shipments to Grow Nearly 31% in 2026 on CSP CapEx Boom

08/03/2026 | TrendForce
Surging investment in AI infrastructure is expected to drive the combined CapEx of the world’s nine largest CSPs up by approximately 90% YoY in 2026, according to TrendForce’s latest AI server research.

Server DRAM Contract Prices to Rise 13-18% QoQ in 3Q26 Amid Long-Term Price Caps

07/09/2026 | TrendForce
TrendForce’s latest memory pricing survey indicates that multiple memory suppliers have already factored in expected price hikes into their prices for the second quarter of 2026.

Optical Interconnects Drive AI Factory Growth; CPO/NPO Market to Top $39B by 2030

06/15/2026 | TrendForce
TrendForce’s recent research on silicon photonics (SiPh) shows that the rapid growth of AI training and inference workloads is pushing AI data centers toward increased power use, higher rack densities, and larger clusters.

Global AI Server Shipments Forecast to Grow Over 28% YoY in 2026

01/20/2026 | TrendForce
North American CSPs' continued investments in AI infrastructure are expected to increase global AI server shipments by more than 28% YoY in 2026, according to the latest market research from TrendForce.

AI Boom Drives Demand for Ultra-Large Packaging as ASICs Expected to Shift from CoWoS to EMIB

11/25/2025 | TrendForce
TrendForce’s latest investigations reveal that the rapid expansion of AI and HPC is increasing the need for heterogeneous integration, positioning advanced packaging as a strategic priority.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in