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Advanced Electronics Packaging Digest

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The Solution Behind the Reliability: Selecting the Right LPM Material

06/19/2026 | LPMS USA
As low pressure molding (LPM) continues to gain adoption across automotive, medical, industrial, consumer, and outdoor electronics applications, LPMS USA is emphasizing the critical role material selection plays in ensuring long-term product reliability and performance.

First Mold Expands University Partnerships to Build Next-Generation Manufacturing Talent Pipeline

06/05/2026 | PRNewswire
First Mold announced a long-term partnership with learning institutions, including universities, to enhance the development of skilled talent within their systems.

Zhen Ding Technology Sets Record High Revenue in May 2026

06/05/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer,  reported May 2026 revenue of NT$16,201 million, up 37.40% YoY and 6.61% MoM, again setting a record high for the same period in the company's history

Road to Reliability: The Foundational Technologies of Materials in EV Reliability

06/04/2026 | Stanton Rak, SF Rak Company
EV reliability is often discussed at the vehicle or system level, but many of the most persistent failures begin at the materials level. Semiconductor devices, ceramic substrates, die attach materials, wire bonds, clips, thermal interface materials, laminates, coatings, seals, and coolants define the electrical, thermal, and mechanical limits of the hardware. Once EV architectures move toward higher voltages, switching speeds, and power density, and longer service life, those materials are pushed harder, and small weaknesses can turn into large field problems

Zhen Ding Technology Joins NVIDIA MGX Ecosystem

06/02/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, announced that it has officially joined the NVIDIA MGX™ ecosystem to empower the next era of accelerated computing.
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