Learning with Leo: Drones—Meeting Demand Without Compromise
Nolan’s Notes: Our Spotlight on North America
Global Sourcing Spotlight: Building a Supply Chain That Bends, Not Breaks
Molex Completes Acquisition of Teramount Ltd.
May 7, 2026 | PRNewswireEstimated reading time: 1 minute
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Teramount Ltd., an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimized for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.
"Teramount's passive, detachable coupling approach supports large assembly tolerances and semiconductor‑grade wafer‑level processes—filling a critical gap in the optical stack," said Aldo Lopez, president, Datacom Solutions, Molex. "By integrating this unique technology into our optical interconnect portfolio, Molex offers a more seamless path from early-stage prototypes to high-volume CPO and other silicon photonics architectures required for the AI era."
Teramount will continue to operate as a design and engineering hub in Jerusalem, supported by Molex's global optical capabilities. It will become part of the Optical Connectivity segment within the Optical Solutions Business at Molex.
Financial terms of the transaction were not disclosed.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
NVIDIA, Corning Partner to Boost U.S. AI Manufacturing
05/06/2026 | BUSINESS WIRENVIDIA and Corning Incorporated announced a multiyear commercial and technology partnership to dramatically expand U.S.-based manufacturing of the advanced optical connectivity solutions needed to power next-generation AI infrastructure.
AI Interconnect Boom Drives Southeast Asia Outsourcing Expansion
05/05/2026 | TrendForceGlobal shipment volume of optical transceivers is projected to more than triple from 26.5 million units in 2023 to over 92 million units by 2026, according to TrendForce’s latest AI infrastructure research.
GlobalFoundries Advances Co-Packaged Optics for AI Data Centers with SCALE Module
05/04/2026 | GlobalFoundriesGlobalFoundries (Nasdaq: GFS) (GF) announced the introduction of its SCALE™ optical module solution for co-packaged optics (CPO).
Global AI Optical Transceiver Market to Reach US$26 Billion in 2026
04/20/2026 | TrendForceTrendForce’s latest research indicates that the global market for AI-focused optical transceivers has entered a phase of rapid growth, with market size projected to expand from US$16.5 billion in 2025 to $26 billion in 2026, representing over 57% YoY growth.
Molex to Acquire Teramount to Accelerate Scalable Co-Packaged Optics Adoption
04/15/2026 | PRNewswireMolex, a global electronics leader and connectivity innovator, announced an agreement to acquire Teramount Ltd., an Israel-based developer of detachable fiber-to-chip connectivity solutions optimized for high-volume Co-Packaged Optics (CPO) and other silicon photonics applications.