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Inspectis AB has introduced a new Micro-Size Optical Probe Tip for its Ball Grid Array (BGA) Inspection System, offering improved image quality and a more robust design for inspection of solder joints beneath today’s increasingly small BGA packages.
“As BGA components continue to shrink, the space between the component and PCB becomes increasingly difficult to access,” said Johan Stormlund, Sales Manager. “Inspecting the solder joints from beneath the BGA can therefore be challenging, particularly in applications where component clearance is extremely limited.”
The new Inspectis Micro Size Optical Probe Tip is designed specifically for these demanding inspection applications, he adds. “Manufactured from stainless steel, the new probe provides a more robust construction while maintaining the compact size required to access narrow spaces beneath BGA components,” Stormlund says. “The improved probe optics also deliver sharper and more detailed images of BGA solder joints, making it easier for operators to evaluate solder quality and identify potential defects.”
“The Micro Size Optical Probe was developed at Inspectis to address one of the most difficult challenges in BGA inspection – seeing clearly into extremely narrow spaces beneath the component,” he says. “With its new stainless-steel construction, we have taken the probe one step further. It is more robust, while the improved optics provide an even better view of solder joints. This combination makes the system an even more powerful tool for demanding BGA inspection.”
The Micro Size Optical Probe utilizes a 90-degree viewing angle to deliver a direct view of the underside of BGA packages. Its compact design, featuring a tip thickness of just 0.8 mm, allows inspection in areas with very limited clearance, while integrated illumination provides consistent lighting of the inspection area. The new probe is fully compatible with the Inspectis BGA Inspection System, and provides manufacturers, EMS companies and quality-control teams with a practical solution for detailed, non-contact inspection of BGA solder joints.
