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Advanced Electronics Packaging Digest

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Flex to Acquire EPC Power

09/09/2026 | Flex
Flex announced that it has entered into a definitive agreement to acquire EPC Power at a value of $4.4 billion, subject to customary adjustments.

Mek (Marantz Electronics) Launches Redesigned PowerSpector JSAz 350 Desktop AOI

09/08/2026 | Mek (Marantz Electronics)
Mek (Marantz Electronics), a global specialist in Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) technology, has announced the availability of its newly redesigned PowerSpector JSAz 350 desktop AOI system.

Lockheed Martin Conducts Second Successful Test of New JR3 Rocket

09/04/2026 | Lockheed Martin
Lockheed Martin has successfully tested its new Joint Reduced Range Rocket (JR3) solution for the second time, an affordable training round with a reusable launch pod designed to replace the current Reduced Range Practice Rocket for the U.S. Army and global partners.

Real Time with... THECA 2026: FSQuality Expands Thailand Capacity for Advanced PCB Markets

09/03/2026 | Real Time with... THECA
Ben Huang, sales director of Europe and America at FSQuality, explains how the company's new Thailand facility is targeting AI, automotive, and industrial applications while transferring manufacturing expertise from China and growing into advanced manufacturing capabilities with processes such as mSAP.

S-Transistors Raises €2.6M to Advance Scalable Quantum Computing Platform

08/31/2026 | VTT
Newly launched Finnish startup S-Transistors, originating from VTT Technical Research Centre of Finland, has raised €2.6 million in pre-seed funding to pioneer a fundamentally new class of integrated circuits based on superconducting transistors.
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