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It’s Only Common Sense: Just Imagine…

06/22/2026 | Dan Beaulieu -- Column: It's Only Common Sense
There’s an old story that says we're all artists in first grade. Just ask a room full of 6-year-olds. One kid draws dinosaurs wearing sneakers. Another builds a spaceship out of cereal boxes and glue sticks. Somebody paints the sky green because they feel like it. Nobody apologizes for their ideas or worries about being judged. They just create without fear. But, as the story goes, we get older. We become more experienced and practical. We learn rules, structure, and how business is “supposed” to work. We slowly trade crayons for spreadsheets and imagination for caution. Little by little, we retire the most creative part of ourselves long before we retire from work.

Thermoreflectance and Solving the Thermal Puzzle in 3D Packaging

06/11/2026 | Marcy LaRont, I-Connect007
Advanced packaging and 3D heterogeneous integration are rapidly redefining the next phase of the semiconductor industry, delivering unprecedented performance gains while posing significant thermal management challenges. In this interview, Dr. Mohammad (Mo) Shakouri, founder and CEO of Microsanj, discusses how thermoreflectance-based metrology is enabling engineers to visualize and measure heat behavior at the nanoscale within complex packages, interposers, and TSV structures.

Three Reasons Manufacturers Are Turning to UV Curable Conformal Coatings

06/11/2026 | I-Connect007
Manufacturers are under increasing pressure to improve reliability while reducing production costs, energy use, and environmental impact. For companies that rely on conformal coatings to protect electronic assemblies from moisture, dust, chemicals, and other environmental hazards, UV-curable technologies are a compelling alternative to traditional coating processes.

Getters, Thermal Management, and High-Reliability Packaging: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

06/10/2026 | I-Connect007
The upcoming issue of Advanced Electronics Packaging Digest explores several technologies shaping the future of advanced packaging, from maintaining stable environments inside hermetic packages to managing heat in increasingly complex 3D architectures. The issue also examines packaging innovations for aerospace, defense, and automotive applications, as well as broader connections between semiconductor interconnects and the systems they support.

Elementary, Mr. Watson: Controlled Impedance—When ‘Connecting the Dots’ Stops Working

06/11/2026 | John Watson -- Column: Elementary, Mr. Watson
Signal integrity follows physics that are consistent, predictable, and fully explainable. But those rules don’t show up in the schematic. Instead, they live in the electromagnetic fields around the traces, in the stackup, and in the relationship between conductors and their return paths. The authors weren’t claiming black magic; they were calling out how it feels until you learn what’s going on. The fact that they said it more than 30 years ago only reinforces how fundamental and enduring these concepts really are.
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