Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Siemens Expands EDA Software Access Through EuroCDP Project
May 14, 2026 | SiemensEstimated reading time: 1 minute
Siemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe's semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.
This collaboration grants companies accepted into the Chips JU program access to Siemens’ cutting-edge electronic design automation (EDA) software under pre-defined pricing and conditions.
“The agreement significantly lowers barriers for smaller companies, startups and research institutions to access world-class design, verification and manufacturing software - the same powerful tools used by industry giants. This creates a more level playing field for innovation within the European semiconductor ecosystem,” said Jean-Marie Saint Paul, senior vice president, EDA Global Sales, Siemens EDA, Siemens Digital Industries Software. “By being the first software provider to establish this framework, we're demonstrating Siemens’ commitment to European technological leadership and positions us as key player in shaping the future of European microelectronics."
“The contract with Siemens is a key enabler for our Design Platform” says Jari Kinaret, the Executive Director of the Chips Joint Undertaking. “The Design Platform is an essential part of the capacity build-up under the Chips Act, helping European startups and SMEs to develop into profitable fabless businesses.”
The collaboration enables EuroCDP participants to:
- Accelerate innovation cycles and reduce development costs
- Focus on design and innovation rather than lengthy procurement negotiations
- Access comprehensive digital twin capabilities and AI-driven design tools
- Achieve cost predictability crucial for R&D budget management
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability
05/14/2026 | I-Connect007I-Connect007 proudly announces the recent release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings, the latest installment in its highly regarded Printed Circuit Designer’s Guide to…™ book series. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new volume offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.
Rethinking Stackup, Materials, and Tolerances in Modern Designs
05/14/2026 | Kristin Moyer, Global Electronics AssociationThe simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
New Courses: Advance Your Electronics Expertise in June and July
05/14/2026 | Global Electronics AssociationStay current with design, manufacturing, and quality standards by enrolling in one of these online instructor-led courses starting in June and July from ElectronicsU at the Global Electronics Association, designed to help professionals at every level sharpen their skills and advance their careers. These live, expert-led sessions combine flexibility with real-time interaction, allowing participants to learn directly from seasoned industry professionals while collaborating with peers worldwide. Access to all applicable IPC standards is included in the courses.
Road to Reliability: Engineering High Uptime EV Charging Infrastructure
05/13/2026 | Stanton Rak, SF Rak CompanyThe transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.
U.S. Aerospace, Defense Firms Accelerate Digital Strategies
05/13/2026 | BUSINESS WIREU.S. aerospace and defense enterprises are adopting integrated digital practices, AI-enabled design and software-centric development approaches as the requirements for competitiveness change, according to a new research report published by Information Services Group (ISG)