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MacDermid Alpha to Address Silver Price Volatility Solutions at ECTC 2026
May 15, 2026 | MacDermid AlphaEstimated reading time: 2 minutes
As volatile silver prices continue to place pressure on semiconductor packaging costs and supply chain predictability, MacDermid Alpha Electronics Solutions will highlight material strategies that help manufacturers reduce dependence on silver without sacrificing reliability, thermal performance, or manufacturing efficiency.
The company will present these solutions at the 2026 Electronic Components and Technology Conference (ECTC), taking place May 26 to 29 in Orlando, Florida.
MacDermid Alpha will exhibit at Booth 135, where it will demonstrate how alternative die attach and interconnect materials can reduce dependence on silver while maintaining the reliability required for advanced semiconductor packages.
Advanced semiconductor packages must deliver greater thermal performance and long-term reliability in smaller, more complex designs. At the same time, manufacturers are under pressure to reduce exposure to commodity price swings. The challenge is identifying materials that balance reliability, manufacturability, sustainability, and cost stability.
At ECTC, MacDermid Alpha will show how its ATROX® product family helps address that challenge. Featured technologies include copper-filler die attach materials designed to reduce dependence on silver and improve cost predictability, PFAS-free die attach solutions that support more sustainable manufacturing, and materials engineered to provide the reliability, throughput, and process flexibility required for high-volume semiconductor assembly.
ATROX® CD 560-1 is a PFAS-free conductive die attach paste designed for high-throughput automated dispensing in metal leadframe packages, helping manufacturers improve cost control and supply stability while maintaining process consistency and long-term reliability.
“Semiconductor packaging teams are under pressure from every direction, including thermal performance, manufacturing efficiency, sustainability goals, and cost volatility,” said Senthil Kanagavel, Director, Standard Die Attach, Semiconductor Assembly, MacDermid Alpha Electronics Solutions. “At ECTC, we want to show that manufacturers do not have to choose between performance and cost control. By reducing dependence on silver and selecting materials more strategically, they can build more reliable and economically resilient semiconductor packages.”
In addition to exhibiting, MacDermid Alpha will present new research on advanced interconnect materials during the conference. Abdelhamid El-Sawy will present “Implanted Nanotwin Boundaries Enable Stable Hybrid-Bondable Copper Metallization” on Thursday, May 28, during Session 39: Interactive Presentations – Bonding Processes and Analysis in Next-Generation Interconnects, from 10:00 a.m. to 12:00 p.m.
The paper introduces a nanotwin-engineered copper architecture designed to overcome one of the key challenges in hybrid bonding: achieving copper stability without compromising purity. The approach helps enable more reliable, oxidation-resistant metallization for advanced 3D packaging, high-bandwidth memory, and chiplet applications.
ECTC brings together the global microelectronics packaging community, including engineers, researchers, equipment manufacturers, materials suppliers, and semiconductor assembly specialists. MacDermid Alpha invites attendees to visit Booth 135 to discuss how advanced interconnect and die attach materials can help semiconductor packaging teams improve cost resilience, support PFAS-free transitions, and maintain long-term reliability.
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