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Technica Tech Day Event on AI and the Large BGA Solution Hits the Mark

05/27/2026 | Technica USA
On May 13–14, 2026, Technica USA hosted its Tech Day Event in San Jose, California, bringing together more than 25 companies and over 60 attendees from across the electronics manufacturing industry. The event focused on how the rapid evolution of artificial intelligence is driving new manufacturing requirements and changing the technologies used for SMT placement, inspection, and process control.

PCB East 2026: AI Infrastructure, Advanced PCB Technologies, and the Future of Electronics Manufacturing

05/19/2026 | Doug Dixon, 360Circuits
After attending PCB East 2026, it became clear to me that the electronics industry is entering a major transition driven by AI infrastructure, increasing power density, and growing system complexity, extending far beyond semiconductors alone. What stood out was how critical PCB technology, materials science, thermal management, and advanced manufacturing have become to the future of electronics. The industry is now facing many challenges, including tighter manufacturing tolerances, material shortages, rising costs, and growing pressure to digitally transform engineering and manufacturing operations.

Signal Integrity Meets Additive Innovation in the Latest Issue of I-Connect007 Magazine

05/18/2026 | I-Connect007 Editorial Team
Signal integrity and metallization are deeply intertwined, and this month’s I-Connect007 Magazine explores that convergence in detail. As Managing Editor Marcy LaRont explains, achieving electrical performance targets doesn’t stop at design; it depends heavily on how boards are fabricated, particularly through precise metallization processes.

What Heterogeneous Integration Means for EMS Providers

05/14/2026 | Nolan Johnson, I-Connect007
Dr. Ravi Mahajan, an Intel Fellow and Director of Intel’s Technology and Pathfinding group, delivered a keynote at the APEX EXPO 2026 technical conference on using heterogeneous integration (HI) as a strategy and on how advanced packaging technology serves as the technical apex for implementing that strategy. Mahajan’s previous papers and industry presentations on such topics as interconnect density, signal integrity, power delivery, thermal path, and assembly yield as system-level constraints confirm him as an expert on package optimization.

More Than a Field Trip: Young Students Step into the World of Electronics and Semiconductors

05/13/2026 | Michigan Tech Electronics Hub
The energy is electric at Michigan Technological University as 164 fourth graders from Michigan’s western Upper Peninsula trade their traditional desks for a day of high-tech exploration. The students are here to pilot Stories & Semiconductors, a new educational series. By following the adventures of characters who solve problems through electronics, young students don’t just read about technology; they build it themselves.
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