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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Micron, General Motors Sign Strategic Agreement to Secure Supply and Accelerate Innovation

07/03/2026 | Micron
Micron Technology, Inc. and General Motors announced a Strategic Customer Agreement (SCA) to secure a long-term, reliable supply of memory and storage platforms critical to GM’s vehicle production and delivery at scale.

UL Solutions Opens Advanced Automotive Electromagnetic Compatibility Laboratory in Japan

06/25/2026 | BUSINESS WIRE
UL Solutions Inc., a global leader in applied safety science, announced the opening of a new automotive electromagnetic compatibility laboratory in Toyota City, Japan, expanding its ability to support increasingly complex vehicle technologies in one of the world’s largest automotive markets.

SafeFields, Veoneer Partner on Automotive EMF Reduction Solutions

05/19/2026 | PRNewswire
SafeFields Technologies, a pioneer in active electromagnetic field (EMF) reduction solutions for vehicles, announced it has entered into a strategic collaboration agreement with Veoneer, a world-leading automotive Tier-1 supplier, to commercialize and produce automotive-grade electronics products incorporating SafeFields' proprietary technology.

onsemi, Geely Expand Strategic Collaboration to Elevate the Driving Experience

05/01/2026 | onsemi
onsemi and Geely Auto Group today announced an expanded global strategic collaboration aimed at accelerating the development of next-generation electric and hybrid vehicles.

Omdia: Cellular IoT Traffic to Hit 218.6 Exabytes by 2035

04/29/2026 | BUSINESS WIRE
Data traffic from cellular IoT connections is expected to rise to 218.6 exabytes (EB) by 2035, according to Omdia’s latest research.
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