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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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LITEON Partners with SUTD and NeuroRAN to Advance AI-RAN and Edge AI over 5G

06/04/2026 | LITEON Technology
The joint demonstration showcases how AI can be natively integrated into 5G Radio Access Networks (RAN), enabling real-time, privacy-preserving, and energy-efficient edge AI applications.

Siemens, Partners Launch Reference Architecture for NVIDIA AI Data Centers

06/03/2026 | Siemens
Siemens – together with NVIDIA and Fluence, and incorporating nVent-aligned design considerations – has developed an NVIDIA DSX Vera Rubin-aligned reference design that translates NVIDIA’s AI factory vision into a deployable, industrialized electrical, power and controls architecture for hyperscalers, colocation providers, and specialized cloud infrastructure providers.

Zhen Ding Technology Joins NVIDIA MGX Ecosystem

06/02/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, announced that it has officially joined the NVIDIA MGX™ ecosystem to empower the next era of accelerated computing.

My Trip to Schneider Electric: AI, Data, and the Need for More Power

06/02/2026 | Marcy LaRont, I-Connect007
AI is pushing power infrastructure to its limits, and many of those same challenges, particularly around power delivery and heat management, parallel what the electronics industry faces in building and scaling advanced microelectronics. Yet when it comes to AI and hardware, we typically only see a small piece of the total picture. So, when Schneider Electric invited me to tour a modern AI data center still under construction, I jumped at the opportunity. This became a fascinating technical journey I’m excited to share.

Bull, Foxconn Partner to Scale AI Infrastructure Manufacturing in Europe

06/01/2026 | Globe Newswire
Bull, a leader in advanced computing and AI, and Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer and leading technology solutions provider, announce a strategic collaboration to manufacture AI and Cloud infrastructure, from Europe to the global market.
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