Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

FPGA AI Chip Market to Surpass $100M Shipments by 2031 Amid Rapid ASP Decline

05/07/2026 | JPR
Jon Peddie Research (JPR), the market research and consulting firm covering graphics, AI processors, and visual computing, released FPGAs in AI, a new market intelligence report analyzing the emerging class of field-programmable chips designed for AI inference at the edge and in the cloud, and for IoT.

Siemens Extends PAVE360 Technology to AMD GPUs Running on Microsoft Azure Cloud

03/11/2025 | Siemens
Siemens Digital Industries Software announced that it has expanded the cloud platforms of choice available for systems-of-systems development with its PAVE360™ technology for Software Defined Vehicle (SDV) development which is now available on AMD Radeon™ PRO V710 GPUs and AMD EPYC™ CPUs running on Azure, Microsoft’s cloud and AI platform.

Accenture Invests in Voltron Data to Help Organizations Use GPU Technology to Simplify Large-Scale Data Processing

02/21/2025 | BUSINESS WIRE
Accenture announced an investment in Voltron Data, a company that is building software to unlock the next generation of accelerated computing that underpins modern AI applications. This investment, made through Accenture Ventures, will support Voltron Data in its efforts to help organizations use advanced computing technology to speed up large-scale analytics, used for generative AI and machine learning applications.

SK Telecom Launches AI Data Center-based GPUaaS

01/15/2025 | SK Telecom
SK Telecom (NYSE: SKM) launched ‘SKT GPU-as-a-Service’ (SKT GPUaaS) today at its AI Data Center (AIDC) in Gasan, Seoul, South Korea. The company has been preparing to launch this on-demand artificial intelligence (AI) cloud service as part of its dedicated AIDC business by investing in Lambda, a global GPU cloud company, to secure stable GPU supplies and expertise.

NVIDIA Blackwell's High Power Consumption Drives Cooling Demands; Liquid Cooling Penetration Expected to Reach 10% by Late 2024

07/30/2024 | TrendForce
With the growing demand for high-speed computing, more effective cooling solutions for AI servers are gaining significant attention. TrendForce's latest report on AI servers reveals that NVIDIA is set to launch its next-generation Blackwell platform by the end of 2024.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in