Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Follow the Story: AI Reshapes the Electronics Supply Chain

09/09/2026 | Michelle Te, I-Connect007
The AI infrastructure boom is creating enormous opportunities for electronics manufacturers, but its effects are spreading well beyond companies building AI servers and data centers. High performance laminates, glass fabric, copper, memory, MLCCs, foundry capacity, and other critical resources are being pulled toward fast-growing AI applications, tightening supplies and pushing up costs elsewhere in the electronics industry. I-Connect007 has been following these developments from several directions. What initially looked like separate stories about laminate availability, memory prices, component demand, PCB capacity, and data-center growth are demonstrating how AI is changing how the electronics supply chain allocates materials, capacity, and investment.

GlobalFoundries, RAAAM Develop Next-Gen GCRAM on FDX Platform

09/02/2026 | GlobalFoundries
GlobalFoundries (GF) and RAAAM Memory Technologies, a pioneer in advanced on-chip memory solutions, announced a strategic collaboration to develop and qualify Gain-Cell RAM (GCRAM) technology.

Everspin, Teledyne HiRel Partner to Accelerate MRAM Adoption in Aerospace and Defense

09/02/2026 | BUSINESS WIRE
Everspin Technologies, Inc., the world’s leading developer and manufacturer of MRAM solutions, and Teledyne HiRel Semiconductors, a business unit of Teledyne Technologies Incorporated and a leading supplier of high-reliability semiconductor solutions, announced a strategic partnership to accelerate adoption of Everspin’s MRAM in aerospace, defense and other demanding systems.

Micron Announces Leadership Appointments to Accelerate Innovation and Growth

08/28/2026 | Micron
Micron Technology, Inc. announced the promotion of two senior executives to newly expanded leadership roles designed to further strengthen the company's execution, innovation and long-term growth strategy.

Memory Prices Soar; DRAM and NAND Flash to Account for 68% of Major CSP CapEx in 2027

08/25/2026 | TrendForce
According to TrendForce’s latest memory industry research, major global cloud service providers (CSPs) are accelerating AI infrastructure investment, with total CapEx projected to surge 98% YoY in 2026 and rise another 50% in 2027.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in