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The SEMI 3D & Systems Summit, taking place June 17–19, 2026 in Dresden, will bring together the world’s foremost experts in advanced semiconductor packaging and heterogeneous systems integration. Themed Enabling Next-Gen Heterogeneous Systems Integration, the Summit will spotlight the latest breakthroughs driving innovation in AI hardware architectures, chiplet design, hybrid bonding, photonics, and AR/VR technologies. From geopolitical dynamics to system-level architectures, attendees will explore the critical role of 3D and heterogeneous integration in shaping Europe’s semiconductor future. Registration is open.
“Dresden is reinforcing its position as one of Europe’s leading semiconductor hubs, and a central pillar driven by the European Chips Act and major investments from TSMC, Infineon, Bosch, and GlobalFoundries,” said Laith Altimime, President of SEMI Europe. “These investments are aimed at accelerating manufacturing of the next-generation semiconductor innovations in Europe advancing Europe's competitiveness, technological sovereignty, and supply chain resilience. As heterogeneous integration becomes a foundation for the future of our industry, collaboration across the value chain will be critical to ensuring Europe remains at the forefront of global innovation.”
