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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Flex Connections: Four Lessons in Engineering Judgment for PCB Designers

08/20/2026 | Dan Skeweres -- Column: Flex Connections
Editor’s note: This begins a new column series by Flexible Circuit Technologies, which will appear monthly in "I-Connect007 Magazine". The column will feature five rotating authors who share expertise from their many years of working with flexible circuits.

A University Model for Training the Next Generation of PCB Designers

08/19/2026 | Marcy LaRont, I-Connect007
Veteran PCB designer and educator John Watson has building one of the nation's most comprehensive university-based PCB design certificate programs in the country. He’s working with Palomar College, UC San Diego, UC Santa Cruz, and UMass Lowell to teach the complete design-to-manufacturing process while connecting students with internships and career opportunities. I spoke with John about the industry's workforce challenges, building meaningful educational pathways, and why the next generation of PCB designers may come from places few would expect.

PCB West Panel to Take On What’s Next for PCB Design

08/19/2026 | PCEA
The Printed Circuit Engineering Association (PCEA) has announced a panel discussion on the technologies reshaping printed circuit board design over the next two to five years will take place at PCB West 2026.

August I-Connect007 Magazine: The Electronics Ecosystem From Design to Development

08/18/2026 | I-Connect007 Editorial Team
This issue of I-Connect007 Magazine examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products. Our contributors explore co-design from multiple perspectives, using analogies from the forest to the Olympics. We also revisit VeCS for high layer count HDI PCB fabrication, plating challenges for advanced packaging, new applications for flex circuits in robots, and how the U.S. national defense policy could affect PCB sourcing.

Marcy’s Musings: The Power of the Electronics Ecosystem

08/19/2026 | Marcy LaRont -- Column: Marcy's Musings
Electronics hardware product design and manufacturing is a completely interconnected (pun intended) and interdependent system. Success depends on every part of the ecosystem functioning together, a reality that once seemed easy to ignore or sideline, but today, few have the time or resources to work independently.
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