Elementary, Mr. Watson: PCB Education in the Midst of the Storms
Beyond Design: How Signals Survive the Hostile PCB Environment
Connect the Dots: What Designers Should Know About Non-conductive Via Fill
QTREX Quantum Ltd. a company focused on advancing Additively Manufactured Electronics (AME) for quantum computing infrastructure, announced a major technical and strategic milestone: the Company has successfully produced a cryogenic chip carrier using its proprietary single-build AME process, based on a design supplied by one of the world's largest U.S.-based technology companies developing full-stack quantum computing systems.
The achievement expands QTREX’s role within the quantum hardware stack into the processor-interface layer, demonstrating that the Company’s AME platform can address both signal transport and critical carrier-level functions around the quantum processor. By enabling these capabilities within a single AME architecture, QTREX believes it is opening a new category of quantum computing components and expanding its addressable opportunity across future quantum system architectures.
A cryogenic chip carrier supports the quantum processor and manages signal fan-out between the processor interface and the cryogenic I/O stack. As quantum systems scale, this interface becomes increasingly important. Higher channel counts require denser routing, stronger shielding, lower thermal load, controlled signal integrity and repeatable manufacturing inside highly constrained cryogenic environments.
QTREX’s carrier uses a Kapton-class polyimide architecture adapted for very low-temperature environments. The single-build AME process is designed to integrate the cryogenic chip carrier and interconnect structure into one monolithic architecture, enabling conductive pathways, dielectric structures, shielding features and direct interconnect transitions to be produced together rather than assembled through separate connectors and manual steps. By reducing connectorized transitions, the architecture is intended to lower potential failure points, simplify the signal path and support substantially higher routing density. Because shielding can be engineered directly into the carrier, and because AME enables 3D routing geometries, this approach can open a new integration path for high-channel-count quantum processors that conventional connector-based architectures are not designed to support.
“Following engagement with multiple quantum computing companies and the evaluation of this capability with one of the industry’s leading players, we view this milestone as representing a meaningful expansion of our position within the quantum hardware ecosystem,” said Dagi Ben-Noon, CEO of QTREX. “By enabling the cryogenic chip carrier and interconnect structure to be produced within the same single-build AME architecture, we are expanding our quantum connectivity platform to include processor-interface functions. This capability further strengthens QTREX’s role in addressing one of the fundamental scaling challenges facing the quantum computing industry.”
Following interest from multiple quantum hardware companies and strategic technology customers, the next phase is expected to focus on customer-specific cryogenic chip carrier designs tailored to each processor architecture, chip design and system-level requirement.
