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Advanced Electronics Packaging Digest

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Extropic Signs $75M LOI with U.S. Commerce Department

08/03/2026 | PRNewswire
Extropic, the American company pioneering thermodynamic computing hardware, announced the signing of a letter of intent with the U.S. Department of Commerce for up to $75 million in funding through the CHIPS Research and Development Office (CRDO).

Koh Young Brings Smart AI Solutions to Consecutive SMTA Regional Events Across North America

07/28/2026 | Koh Young
Koh Young Technology, the global leader in True3D measurement-based inspection and smart AI solutions, will strengthen its engagement with electronics manufacturers across North America through consecutive appearances at two SMTA regional events this August.

Safran, SatSure Forge a Strategic Partnership to Advance Geospatial Intelligence (GEOINT)

06/23/2026 | Safran
As part of the France-India Year of Innovation, Safran Electronics & Defense and SatSure have signed a Memorandum of Understanding (MoU) to formalize their collaboration in Geospatial Intelligence (GEOINT). 

ICEYE Leads New Era of Sovereign Intelligence from Space with €1B Funding Round

06/11/2026 | ICEYE
ICEYE, the world leader in sovereign intelligence from space, has raised EUR 450 million (USD 520 million) in a primary Series F funding round led by General Atlantic, at a valuation of over EUR 10 billion (USD 12 billion).

Airbus Defence and Space Forms Sovereign Space Intelligence Consortium

06/10/2026 | Airbus Defence and Space
Airbus Defence and Space has signed a Memorandum of Understanding with Rohde & Schwarz, constellr, Orbint and High Performance Space Structure Systems (HPS) to collaborate on a satellite-based Earth observation and Intelligence, Surveillance, and Reconnaissance (ISR) solution.
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