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Advanced Electronics Packaging Digest

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Designing for a More ‘Intelligent’ and Connected Future

09/15/2026 | Marcy LaRont, I-Connect007 Magazine
With more collaborative and computationally demanding PCB designs, cloud-based workflows are rapidly moving from possibility to reality. But greater connectivity also raises new questions about data security, intellectual property, and the sharing of design information in an increasingly complex electronics ecosystem. In this interview, Kristin Moyer of the Global Electronics Association explores the benefits and challenges of cloud-based design environments, the growing importance of standardized data transfer protocols such as IPC-1751 and IPC-2581, and why a secure, intelligent data ecosystem will be essential for the future of co-design, automation, and advanced electronics manufacturing.
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