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Advanced Electronics Packaging Digest

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The Test Connection, Inc. Becomes First Test Engineering Company in Space

06/30/2026 | The Test Connection Inc.
TTCI recently contributed engineering time and resources to the Observation & Detection Interpreted by Neural-networks (ODIN) project, a student-developed payload by Capitol Technology University in Laurel, Maryland.

Boeing Selected by U.S. Space Force to Extend Secure Military Communications Worldwide

06/29/2026 | Boeing
The U.S. Space Force has selected Boeing to advance the next phase of a program that will help extend and improve secure military communications for users around the world.

Airbus Signs MOU to Explore Japanese Eurodrone Variant

06/29/2026 | Airbus
Airbus has signed a Memorandum of Understanding (MoU)  with Kawasaki Heavy Industries. Under the MoU, Airbus, in cooperation with  Kawasaki Heavy Industries, will analyse opportunities to work on a Japanese anti-submarine warfare variant of the U950 Eurodrone, Europe’s first Large Long Endurance Remotely Piloted Aircraft System (RPAS).

European Commission Approves €76 Million German State Aid for First-of-a-kind Semiconductor Testing Equipment Facility

06/25/2026 | European Commission
The European Commission has approved, under EU State aid rules, a €76 million German measure to support QuantumDiamonds GmbH to set up a new facility for the production of semiconductor testing equipment in Munich.

Muon Space Officially Opens High-Mix Satellite Manufacturing Facility in San Jose

06/23/2026 | Muon Space
Muon Space, the Mission Foundry for high-performance satellite constellations, announced the grand opening of its new advanced manufacturing facility in San Jose, California.
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