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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Global Electronics Association Updates Sustainability Reporting Resource for the Electronics Industry

09/16/2026 | Global Electronics Association
The Global Electronics Association announced the relaunch of its Double Materiality Assessment (DMA) Toolkit for the Electronics Industry, an updated resource designed to help organizations navigate double materiality assessment planning amid changing sustainability and corporate reporting expectations.

Rehm Thermal Systems at Bondexpo 2026: Precise Dispensing Meets Efficient UV LED Curing

09/15/2026 | Rehm Thermal Systems
When the industry meets at Bondexpo in Stuttgart from 6 to 8 October 2026, Rehm Thermal Systems will also be presenting innovative equipment solutions for precise dispensing, potting and curing processes. In hall 6 at  booth 6505, the company will showcase the ProtectoXC and the RDS UV LED – two powerful systems designed for flexible, efficient and reproducible production processes.

Global Sourcing Spotlight: Finding Your Greatest Sourcing Asset in Partnerships

09/16/2026 | Bob Duke -- Column: Global Sourcing Spotlight
Something I’ve learned over time is that when supply is tight or a disruption hits, procurement teams can quickly determine which supplier relationships are working. A supplier that understands your business is more likely to call early about a material shortage, suggest an alternative, or find room in a crowded production schedule. That response has become increasingly valuable as tariffs shift, trade routes change, and materials fluctuate in cost and availability.

Advanced Packaging at the Limits: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

09/15/2026 | I-Connect007
The upcoming issue of Advanced Electronics Packaging Digest looks at what happens as advanced packaging pushes further into the limits of scale, power, thermal performance, and manufacturing capability. These features examine the measurement technologies, materials decisions, manufacturing investments, and system-level challenges shaping the next generation of advanced electronics.

Indium Promotes Chris Bastecki to Business Unit Vice President

09/11/2026 | Indium Corporation
Indium Corporation is pleased to announce the promotion of Chris Bastecki to Business Unit Vice President, Americas Sales & Service and Global Printed Circuit Board (PCB) Assembly Materials Marketing.
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