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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Base Material Properties and Microvia Reliability

07/01/2026 | Ed Kelley, Victory Giant Technology
The drive toward higher circuit density is challenging PCB manufacturers and their supply chains alike, with base materials as a critical foundation for complex designs. HDI designs present specific challenges and requirements for these materials, but given the myriad possible designs and applications, there is no optimal “one size fits all” material. Perhaps the most challenging HDI designs are those that use stacked vs. staggered microvias, with the number of layers of stacked microvias and the pitch between them as critical variables.

Transforming PCB Design from Reactive to Predictive With Digital Twins

07/01/2026 | Stephen V. Chavez, Siemens EDA and PCEA
For decades, PCB development has largely followed a sequential process. Design teams create the schematic, develop the layout, fabricate prototypes, perform validation testing, identify problems, revise the design, and repeat the cycle until the product eventually meets specifications. While this approach has historically been accepted as normal, it is increasingly incompatible with modern product demands, where development speed, quality, and predictability define competitive advantage.

Connect the Dots: PCB Manufacturing Focused on Value

06/29/2026 | Matt Stevenson -- Column: Connect the Dots
PCB manufacturing has become more complex, not only to meet the growing need for more advanced, smaller boards, but also to address supply chain disruptions and uncertainty about the cost of critical raw materials. This environment makes it harder for our customers, too. Relatively straightforward decisions about choosing a PCB manufacturer have become more challenging.

2026 Electronics Day Design France Brings Together Europe's Electronics Design Community in Toulouse

06/29/2026 | Anastasia Ederer, Global Electronics Association
More than 120 participants gathered onsite in Toulouse, with an additional 20 joining online, for the 2026 Electronics Day Design France, organised by Global Electronics Association in collaboration with IPC Designers Council France.

Building Better HDI Boards: Driving Quality Through Lamination

06/29/2026 | Marcy LaRont, I-Connect007 Magazine
All4-PCB, a technology-focused supplier serving the PCB, IC substrate, chemical milling, and LTCC markets, works with manufacturers across North America to deliver equipment, materials, and process solutions that address the lamination challenges of HDI, advanced packaging, and complex multilayer designs. Under the leadership of Managing Director Ralph Jacobo, the company has continued expanding its support for advanced electronics manufacturing operations.
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