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Advanced Electronics Packaging Digest

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Silex Establishes U.S. Manufacturing Capacity – Acquires Semiconductor Fab in Pennsylvania

07/07/2026 | Silex Microsystems
Silex Microsystems has entered into a definitive agreement to acquire a 200 mm integrated circuit fab in Pennsylvania, USA, from Semiconductor Components Industries, LLC.

Global Semiconductor Sales Increase 9.2% On-Month in May

07/07/2026 | SIA
The Semiconductor Industry Association (SIA) announced global semiconductor sales were $120.6 billion during the month of May 2026, an increase of 9.2% compared to the April 2026 total of $110.5 billion and 104.1% more than the May 2025 total of $59.1 billion.

Asahi Kasei Expands SUNFORT for Advanced Packaging

07/07/2026 | BUSINESS WIRE
Asahi Kasei, a diversified global company, constructed a new slitting facility for SUNFORT™ dry film photoresist (DFR) at its manufacturing site in Tainan, Taiwan, on July 3. Commercial operations are scheduled to commence this month.

onsemi Advances Fab Right Strategy with Agreements to Divest Two Manufacturing Facilities

07/07/2026 | Globe Newswire
onsemi announced it has entered into definitive agreements to divest two manufacturing facilities.

Infineon Opens World's Largest Fab for Power and Analog/Mixed-Signal Semiconductors in Dresden

07/02/2026 | Infineon
Infineon Technologies AG opened the Smart Power Fab in Dresden several months ahead of schedule. The new plant, with an investment volume of five billion euros, is the largest single investment in Infineon's history and one of the largest investment projects in Germany, creating 1,000 new, direct jobs.
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