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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Analog Devices Completes Acquisition of Empower Semiconductor

07/08/2026 | PRNewswire
Analog Devices, Inc. announced the completion of its acquisition of Empower Semiconductor. The combination further strengthens ADI's position as a leading strategic, system-level grid-to-core power partner across the entire AI ecosystem, expanding ADI's total addressable market and capabilities in AI compute power delivery.

Micron and Ford Sign Strategic Agreement to Strengthen Long-Term Memory Supply and Industry Resilience

07/08/2026 | Micron
Micron Technology, Inc. and Ford Motor Company today announced a long-term Strategic Customer Agreement (SCA) to strengthen the supply of memory and storage solutions supporting Ford’s next-generation vehicle production.

Designers Notebook: Old vs. New School System-level Packaging—Flip-Chip to Chiplets

07/08/2026 | Vern Solberg -- Column: Designer's Notebook
The electronics industry has experienced a renaissance in semiconductor package technology, driven by the need to maximize electronic product functionality while minimizing the area reserved for component mounting and interconnects. Passive surface mount components are relatively small, while the packaged semiconductor die is significantly larger than the tiny die element it encases. The plastic-packaged semiconductor, although suitable for use on PCBs, is far too bulky for those developing electronics that require miniaturization: new product introduction systems for physically stressful operating conditions, such as aeronautics, military ordinance, and space missions.

Remtec Announces the Industry's Most Complete Suite of Plating Capabilities Including PCTF Technology for Advanced Electronic Packaging

07/07/2026 | Remtec
Remtec, a leader in advanced metallized ceramic substrates and electronic packaging solutions, is proud to announce the availability of what is believed to be the industry's most comprehensive portfolio of plating surface finish technologies for thick film ceramic circuits and advanced electronic assemblies.

Micron Begins Construction of Cleanroom at Hiroshima Plant to Support Advanced Memory for AI Applications

07/07/2026 | Micron
Micron Technology, Inc. today announced the commencement of construction on a new cleanroom at its Hiroshima plant in Higashihiroshima, Hiroshima Prefecture.
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