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Elementary, Mr. Watson: PCB Design is a Team Sport (Revisited)

08/26/2026 | John Watson -- Column: Elementary, Mr. Watson
At the Tokyo 2020 Olympics, the U.S. men’s 4x100-meter relay team of Trayvon Bromell, Fred Kerley, Ronnie Baker, and Cravon Gillespie was expected to contend for gold. With some of the fastest sprinters in the world, simply reaching the final seemed almost certain. Instead, the heavily favored team finished sixth in its qualifying heat and failed to advance, missing the final by just two-hundredths of a second. This massive disappointment was not due to a lack of individual speed but to a poorly executed baton exchange between Kerley and Baker, which forced both runners to slow down at the most critical moment.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/21/2026 | Michelle Te, I-Connect007
Some situations came up for me this week (delayed flights and malfunctioning work software) that highlighted how much we rely on tools every day. When they’re working, we barely think about them. When they’re not, we’re suddenly reminded of everything else that has to be in place for the work to get done: good processes, knowledgeable people, communication, teamwork, and sometimes ingenuity. I’ve observed that engineers aren’t any different in their work.

Follow the Story: The Business of Engineering

08/19/2026 | I-Connect007
Building great products requires great engineering, but building a successful engineering company requires something more. Leaders must make decisions about investments, acquisitions, workforce development, automation, sourcing, strategy, and innovation, all while navigating changing markets and emerging technologies. This collection of articles and columns explores the business side of technical leadership, by gathering perspectives from executives, engineers, entrepreneurs, and industry experts who understand that long-term success depends on more than technical excellence.

August I-Connect007 Magazine: The Electronics Ecosystem From Design to Development

08/18/2026 | I-Connect007 Editorial Team
This issue of I-Connect007 Magazine examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products. Our contributors explore co-design from multiple perspectives, using analogies from the forest to the Olympics. We also revisit VeCS for high layer count HDI PCB fabrication, plating challenges for advanced packaging, new applications for flex circuits in robots, and how the U.S. national defense policy could affect PCB sourcing.

3 Key Takeaways: Factory Analytics Turns Data Into Action

08/17/2026 | I-Connect007
Every electronics manufacturer generates data. The challenge is knowing what to do with it. In The Printed Circuit Assembler's Guide to... Factory Analytics, Julie Cliche-Dubois of Cogiscan explains how manufacturers can transform disconnected machine data into meaningful insights that improve productivity, quality, and profitability. Rather than focusing on analytics as an IT initiative, the book demonstrates how factory-wide visibility empowers everyone, from line operators to quality managers, to make smarter decisions.
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