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Advanced Electronics Packaging Digest

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Hitachi Energy, Ansaldo Energia Partner on Integrated Power Solutions

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Hitachi Energy and Ansaldo Energia signed a Memorandum of Understanding to develop and market integrated power solutions designed to help customers secure reliable power faster and meet rapidly growing electricity needs with greater flexibility, resilience and speed.

Polar, IC-Link by imec Partner on 8-Inch GaN Manufacturing

10/19/2026 | Polar Semiconductor, LLC
Polar Semiconductor, LLC (Polar), a U.S.-owned and operated foundry specializing in high-voltage, power, and sensor technologies, and IC-Link by imec, imec’s design and manufacturing service, announced they are collaborating to provide 8-inch production of enhancement-mode (e-mode) GaN devices to serve critical markets such as AI data centers, automotive, aerospace & defense, and the industrial grid.

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HDP, Global Electronics Association Release New Copper Foil Profile Test Method

10/19/2026 | HDP User Group
High Density Packaging User Group (HDP) and the Global Electronics Association are pleased to announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.

High Density Packaging User Group and Global Electronics Association Announce New Copper Profile Test Method

10/15/2026 | Global Electronics Association
High Density Packaging User Group (HDP) and the Global Electronics Association announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.
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