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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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TTM Technologies Arrives at the 2026 Farnborough International Airshow

07/14/2026 | TTM Technologies
TTM Technologies, Inc., a leading global manufacturer of advanced electronics and interconnect solutions for aerospace, defense, and high-technology markets, announced its exhibition at the upcoming 2026 Farnborough International Airshow — the world's premier aerospace and defense event.

Power Delivery, AI Infrastructure, and Materials Innovation: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

07/14/2026 | I-Connect007 Editorial Team
The upcoming issue of Advanced Electronics Packaging Digest examines three areas where packaging technology is increasingly defining system performance: power delivery for AI accelerators, the rapid expansion of AI data centers, and the growing importance of substrate materials in high-reliability electronics. Together, these features explore how packaging decisions influence performance, reliability, and long-term scalability across the electronics ecosystem.

Qnity Unveils Sustainability Goals to Power the Next Era of Advanced Electronics

07/13/2026 | Qnity
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced its sustainability goals, measurable commitments designed to advance sustainable innovation across the semiconductor and advanced electronics industry.

Rebound Electronics Joins the Jabil Family

07/13/2026 | Rebound Electronics
Jabil, Inc. is proud to announce that Rebound Electronics is now part of the Jabil family of companies.

Meet the Author Podcast: Exploring the Growing Role of UV Curable Conformal Coatings with Dow

07/13/2026 | I-Connect007
UV curable conformal coatings are gaining momentum for good reason. Faster processing, simplified manufacturing, and improved reliability have made the technology an attractive option for electronics manufacturers looking to improve production without sacrificing performance. In the latest Meet the Author podcast from I-Connect007, Managing Editor Nolan Johnson welcomes Brian J. Chislea and Cody Schoener, PhD, of Dow, Inc. to discuss their new book, The Printed Circuit Designer's Guide to... UV Curable Conformal Coatings.
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