Punching Out: Preparing Your PCB/EMS Business for Sale
It's Only Common Sense: Your Expertise Builds Your Brand
Dan’s Biz Bookshelf: Revisiting 'The Popcorn Report'
Technica USA welcomed another customer to its San Jose Demo Center this week, reinforcing the company's commitment to providing hands-on demonstrations, technical education, operator training, and application evaluations for customers across the PCB fabrication and PCB assembly industries.
The Demo Center serves as a valuable resource where customers can evaluate leading manufacturing technologies in a real-world environment while working directly with Technica's technical experts and industry-leading supply partners.
"We are pleased to provide this resource for our customers and supply partners," said Jason Perry, President of Technica USA. "Our Demo Center is one of the many ways we create value by helping customers evaluate new technologies, improve their manufacturing processes, and make informed investment decisions."
In addition to private customer demonstrations held throughout the year, Technica regularly hosts educational events designed to help manufacturers address today's production challenges.
On August 12–13, Technica will host a Lunch & Learn event for PCB assembly (PCBA) customers featuring supply partners DCT and Rehm Thermal Systems. During the sessions, attendees will learn about both standalone and integrated equipment solutions designed to improve manufacturing performance by addressing common production issues, including reduced heat transfer efficiency, poor soldering quality, increased defect rates, equipment malfunctions, and unplanned downtime.
During the week of September 20–25, Technica, in collaboration with supply partner ASMPT, will host a private demonstration week featuring the SIPLACE CA-2. This advanced platform picks directly from wafer and places onto substrate, supporting the rapidly growing System-in-Package (SiP) and Advanced Packaging markets. The technology combines traditional SMT component placement with high-speed, micron-level direct die assembly from sawn wafers, enabling manufacturers to meet the evolving demands of advanced electronic packaging.
In November, Technica will host its annual Customer Appreciation Event in partnership with its supply partners. The event will include networking opportunities, product demonstrations, games, prizes, food, and refreshments as a way to thank customers for their continued partnership.
Customers interested in attending any of these events or scheduling a private Demo Center visit are encouraged to contact Yannick Green at ygreen@technica.com for additional information.
