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Advanced Electronics Packaging Digest

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NAND Flash Supply Growth to Outpace Demand in 2027, Easing Supply Constraints in 2H27

07/21/2026 | TrendForce
TrendForce’s monthly July NAND Flash update reveals that the NAND Flash market has remained undersupplied throughout 2026, driven by surging AI-related demand and limited capacity expansion.

Vertical Aerospace Makes History With First Public eVTOL Transition Flight at Farnborough International Airshow

07/20/2026 | Vertical Aerospace
Vertical Aerospace, a global aerospace and technology company pioneering electric aviation, today made history by completing the first public electric vertical take-off and landing (eVTOL) flight at Farnborough International Airshow, switching from helicopter mode to airplane mode and back again.

Kaney Announces $2.88 Million Investment to Expand BGT Aerospace Operations in Freeland

07/20/2026 | Kaney, Inc.
Kaney, Inc., a Velocity One portfolio company, today announced a $2.88 million investment in its BGT Aerospace facility in Freeland, Michigan, expanding manufacturing capacity, adding advanced production equipment, and reinforcing the company's long-term commitment to the local community

UK invests in Homegrown Space Tech to Boost National Resilience

07/20/2026 | UK Space Agency
The funding will support new satellite communications systems and space innovation projects, helping turn early-stage ideas into commercial products, strengthen the UK’s ability to monitor and protect assets in orbit, and build a more resilient domestic space sector.

Tower Semiconductor with METI Support Announces Strategic Capacity Expansion in Japan

07/20/2026 | Tower Semiconductor
Tower Semiconductor, a leading foundry of high-value analog semiconductor solutions, announced a parallel dual-track strategic expansion of its 300mm Silicon Photonics (SiPho), Silicon Germanium (SiGe), and advanced packaging capabilities in Japan, with support from the Government of Japan.
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