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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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TSMC Expands U.S. Semiconductor Investment to $265B

07/22/2026 | U.S. Department of Commerce
The White House and the Department of Commerce announced an incremental $100 billion investment by TSMC for advanced semiconductor manufacturing and packaging facilities in Arizona.

Intel, Fortinet Advance Cybersecurity, Supply Chain Resilience

07/22/2026 | Intel Corporation
Intel Corporation and Fortinet, announced a strategic collaboration to develop Fortinet Security Processor 6 (SP6).

Meet the Author Podcast: Bert Horner on Design for Test

07/22/2026 | I-Connect007
I-Connect007 is pleased to announce the release of Episode 7 of the “Meet the Author” podcast, featuring Bert Horner, president of TTCI, discussing his new book, The Printed Circuit Assembler's Guide to... Design for Test. In this conversation with Nolan Johnson, Horner explores what he calls the "Butterfly Effect" of Design for Test (DFT): Decisions made early in the design process can significantly influence manufacturing success, product reliability, and long-term profitability.

From Prototype to Product: Why E-Textile Standards Matter

07/22/2026 | Chris Jorgensen, Global Electronics Association
Imagine a neonatal monitoring wrap used in a hospital to track an infant’s vital signs during transport between units. It looks and feels like a soft textile. But embedded within it are conductive pathways, sensors, interconnections and electronics that must perform in a critical moment. If the product fails, the issue is not simply a garment defect or an electronics defect. It could affect clinical decision-making. That is what makes e-textiles so promising and so challenging.

Wistron Opens First U.S. Smart Factory

07/22/2026 | Wistron
Wistron Corporation celebrated the grand opening of its D1 AI smart facility in Fort Worth, Texas, the site where the first NVIDIA GB300 Grace Blackwell Ultra Superchip was built and mass-produced in the United States.
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