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Advanced Electronics Packaging Digest

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DuPont Announces Collaboration with Microsoft and NobleAI to Accelerate R&D Innovation with AI

11/13/2026 | PRNewswire
DuPont announced a collaboration with Microsoft and NobleAI to expand access to advanced AI tools and resources, including machine learning that helps its scientists and engineers innovate faster.

ASMPT Management Team Visits Technica USA to Advance Collaboration on AI-Driven Electronics Manufacturing

11/13/2026 | Technica USA
Technica USA was pleased to welcome members of ASMPT’s management team to its headquarters and Demo & Applications Center this week. Technica’s facility serves as a hub for customer demonstrations, technical training, application development, and industry events throughout the year.

UCIe Consortium Releases 4.0 Specification for System-Level Integration

11/13/2026 | BUSINESS WIRE
The Universal Chiplet Interconnect Express® (UCIe®) Consortium, the open standards group for interconnects between chiplets within a package, announced the release of the UCIe 4.0 Specification, taking the UCIe architecture beyond chiplet-level interface design to address key requirements for integrating multiple chiplets into a cohesive on-package system.

CORSAIR PRO to Optimize Engineering Workstations, Servers and Clusters for Ansys Simulation

11/13/2026 | BUSINESS WIRE
Corsair Gaming, Inc., a leading global provider and innovator of high-performance products for gamers, streamers, content-creators, performance PC builders, and SIM Racing enthusiasts, has joined the Ansys Technology Partner Program, part of Synopsys, to deliver HPC systems that accelerate and simplify deployments.

Indium to Highlight Advanced Thermal Management Solutions for Supercomputing at SC26

11/13/2026 | Indium Corporation
Indium Corporation, a leading materials manufacturer and supplier to the global electronics, semiconductor, and thermal management markets, will feature a range of high-reliability, AI-enabling advanced materials at the International Conference for High Performance Computing, Networking, Storage, and Analysis (SC26), November 17-19, in Chicago, Illinois.
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