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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Visionbay.ai Launches Taiwan’s Largest NVIDIA HGX B300 AI Cluster

08/04/2026 | Foxconn
Visionbay.ai, an NVIDIA Cloud Partner (NCP) in Taiwan, announced the commercial launch of its first 5MW AI cluster powered by NVIDIA HGX B300 systems, the largest deployment of its kind nationwide.

AI Server Shipments to Grow Nearly 31% in 2026 on CSP CapEx Boom

08/03/2026 | TrendForce
Surging investment in AI infrastructure is expected to drive the combined CapEx of the world’s nine largest CSPs up by approximately 90% YoY in 2026, according to TrendForce’s latest AI server research.

Amkor, NVIDIA Partner to Expand AI Packaging and Test

07/29/2026 | BUSINESS WIRE
Amkor Technology, Inc. announced a multi-year strategic partnership with NVIDIA to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms.

IBM, Visionbay.ai to Accelerate the Next Era of AI Across Asia Pacific

07/29/2026 | Foxconn
IBM and Visionbay.ai – backed by Hon Hai Technology Group (Foxconn) — announced a collaboration to develop an AI platform and expand Visionbay’s AI App Store for enterprises and regulated industries across Asia Pacific.

Gartner Forecasts Worldwide IT Spending to Grow 14.2% in 2026, Totaling $6.37 Trillion

07/27/2026 | Gartner, Inc.
Worldwide IT spending is expected to reach $6.37 trillion in 2026, up 14.2% from 2025, according to the latest forecast by Gartner, Inc., a business and technology insights company.
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