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Advanced Electronics Packaging Digest

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Wolfspeed Secures Conditional $1.5B U.S. Defense Loan Commitment

10/14/2026 | Wolfspeed
Wolfspeed, Inc. announced it has received a conditional loan commitment letter from the U.S. Department of War (DoW), through its Office of Strategic Capital (OSC), for up to $1.5 billion of long-term financing to support the domestic development and production of silicon carbide (SiC) materials and wide bandgap power devices, with an additional focus on U.S. national security applications.

AT&S Announces Early Redemption of 2022 Hybrid Bond

10/12/2026 | AT&S
AT&S will redeem its outstanding 2022 hybrid bond with a nominal amount of €350 million on 22 October 2026, the first available call date.

Quantum Systems Raises $1.2Bn Series D to Accelerate Growth and Scale Software-defined Autonomous Systems

07/03/2026 | Quantum Systems
Quantum Systems today announced the signing of its $1.2 billion Series D financing round, valuing the company at  ~ $8 billion on a post-money basis.

Thailand’s Smartphone Market Grew 17.1% in 2024 to 16.9 Million Units

02/13/2025 | IDC
According to International Data Corporation ’s (IDC) Worldwide Quarterly Mobile Phone Tracker, Thailand’s smartphone market shipped 16.9 million units in 2024, marking a 17.1% year-on-year (YoY) growth.

ICAPE Announces Successful Arrangement of Financing

01/18/2024 | De Gaulle Fleurance
The ICAPE Group, a global technology distributor of printed circuit boards (“PCBs”), announces the successful arrangement of financing with a pool of 9 European banks, as well as the issue of Relance Bonds.
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