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Advanced Electronics Packaging Digest

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Missing Information Slows Wire Harness Quotes, WHMA Survey Finds

10/29/2026 | Global Electronics Association
Wire harness manufacturers responding to a new Wiring Harness Manufacturer’s Association (WHMA) survey say waiting for information, not preparing estimates, is a leading reason customer quotes take longer.

Cetec ERP 5.0 Launches in Beta with Configurable Dashboards, Live List Screens and Redesigned Interface

10/28/2026 | Cetec ERP
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Indium Expert to Explore Factors Driving Performance of Compressible Metal TIMs at TestConX China

10/28/2026 | Indium Corporation
Indium Corporation® Assistant Product Manager Foo Siang Hooi will discuss the critical factors that influence the performance of compressible metal thermal interface materials (TIMs) and their role in addressing the demands of next-generation cooling applications at TestConX China, October 29, in Suzhou, China.

Rehm Thermal Systems Introduces Vision RCC

10/28/2026 | Rehm Thermal Systems
Rehm Thermal Systems has launched the new Vision RCC, an innovative reflow soldering system specifically developed to meet the requirements of heavy and complex electronic assemblies.

What AI Servers Are Asking of the PCB

10/29/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.
AI infrastructure is pushing PCB performance into new territory. As data rates move from 56 Gbps to 112, 224, 337 Gbps and beyond, the challenge isn't simply building more boards to support growing computing demand. Those boards also have to carry faster signals with less loss, often across increasingly complex, high-layer-count constructions. That puts new pressure on one of the most fundamental parts of the PCB: its materials.
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