Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Teledyne FLIR Defense Delivers 3,000th Ranger® Series Radar

08/12/2026 | BUSINESS WIRE
Teledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced that it has built and shipped its 3,000th Ranger® surveillance radar system from its engineering, service, and production site in Laval, Quebec.

Celestica Completes Equity Offering

08/12/2026 | Celestica
Celestica Inc., a global leader in data center infrastructure and advanced technology solutions, announced that it has completed its previously announced equity offering of 9,677,419 common shares at a price to the public of $310 per share.

I-Connect007 Welcomes New Columnists from Flexible Circuit Technologies

08/12/2026 | I-Connect007
In an exciting new column for I-Connect007 Magazine, a team of application engineers from Flexible Circuit Technologies will draw on decades of experience designing and manufacturing flex and rigid-flex circuits to offer practical guidance to help PCB designers make better engineering decisions. Mark Finstad, Chris Clark, Terrill Schmidt, Dan Skweres, and Zack Schaner will rotate authoring the new column, called Flex Connections, which begins in the August issue, with Dan drawing on his many years of experience to explain why just because you can do something in PCB design, doesn’t mean you should.

Advanced Packaging, Materials Characterization, and System Integration: What’s Ahead in the Advanced Electronics Packaging Digest

08/11/2026 | I-Connect007 Editorial Team
The August issue of Advanced Electronics Packaging Digest explores how advanced packaging is reshaping semiconductor innovation through better materials characterization, heterogeneous integration (HI), workforce education, and system-level design. Together, these features examine the technologies and engineering decisions driving the next generation of electronic systems.

American Standard Circuits to Exhibit at the 2026 Space and Missile Defense Symposium in Huntsville

08/10/2026 | American Standard Circuits
American Standard Circuits will be exhibiting at the 2026 Space and Missile Defense Symposium in Huntsville, Alabama.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in