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Advanced Electronics Packaging Digest

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Micron Invests in New York Critical Minerals Processing with Indium Corporation

10/29/2026 | Micron
Micron Technology, Inc. announced an investment in critical minerals processing and high-purity materials manufacturing that is expected to support the expansion of Indium Corporation’s capabilities in Central New York, restarting domestic processing of critical minerals essential to advanced semiconductor manufacturing.

Phison Receives Micron Global Supplier Awards

10/28/2026 | BUSINESS WIRE
Phison Electronics, a global leader in NAND flash controllers and storage solutions, is honored to announce that it was presented with Outstanding Supplier Performance Awards in the Semiconductor category and the Best in Quality – Assembly and Test category at the Micron Supplier Day 2026.

Trouble in Your Tank: HDI and UHDI—Building the Foundation of Advanced Packaging

10/12/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry ecosystem has never been more robust or dynamic. AI is a major factor in this rapid growth, fueling advances in high performance computing (HPC), advanced memory, high speed networking, and optical interconnects. In addition, advanced semiconductor packaging and data center build-out are pushing HDI and UHDI fabrication to circuit densities not seen previously.

Micron Unveils Ultra-Dense Memory Module for Next-Gen Servers

09/18/2026 | Micron
Micron Technology, Inc., announced a major milestone in memory innovation with the successful demonstration of the world's first 512GB DDR5 module on multiple server platforms.

KYZEN to Feature MICRONOX Chemistries at IMAPS Symposium 2026

09/15/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 28-October 1 at the Encore Boston Harbor in Everett, MA.
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