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As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products that are “Electrifying the Future” at PCIM Asia 2026, August 26-28, in Shenzhen, China.
The company will feature the following products:
- Formic Acid Soldering Technology (FAST) is an ideal reflow method for power device packaging. Product offerings, including preforms, InFORMS®, and novel solder pastes, enable high-reliability, flux-free soldering, ideal for efficient manufacturing of next-generation power electronics.
- InFORCE® pressure sinter pastes are high-metal, low-organic content sinter materials available in both silver and copper. Its low-organic content composition affords short drying times for increased throughput and less volume reduction between wet and post-sintered deposits, reducing the paste amount required.
- InFORCE®29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
- InFORCE®MF is a proven pressure Ag sinter paste designed for SiC die-attach application and is specially formulated for printing and dry-placement processes. This paste offers outstanding die shear strength, thermal conductivity, and mechanical reliability.
- InBAKE™29 is a Cu sinter paste developed for power discrete die-attach applications and applications requiring high thermal conductivity, high electrical conductivity, and high service/operating temperatures. It is specifically designed for pressureless, batch oven sintering.
