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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

July 2022 Issue of Design007 Magazine Available Now

07/11/2022 | I-Connect007 Editorial Team
Thanks to the “left shift” of signal integrity functionality too early in the design cycle, designers are using field solvers more than ever before. But even experienced SI engineers risk “garbage in, garbage out” if they input the wrong data. In the July issue of Design007 Magazine, we focus on the proper use of field solvers and how to avoid getting hurt by GIGO.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/26/2021 | Andy Shaughnessy, Design007 Magazine
This week, we have a round-up of stories from around the industry, including a Real Time with… IPC APEX EXPO interview with Ventec, an article by Tamara Jovanovic about eliminating “garbage in, garbage out,” a review of an EIPC webinar by Pete Starkey, and news about another trade show going virtual this summer. And last but certainly not least, we bring you our one-minute video salute to all the fantastic people in this industry who we’ve worked with for decades. Enjoy!

Turning ‘Garbage In, Garbage Out' into ‘Good In, Good Out’

03/23/2021 | Tamara Jovanovic, Happiest Baby
In the PCB design cycle, it is so easy to unintentionally introduce “garbage” into your system. Unless you have time to extensively check everything you bring in from an external source, it is very likely that something will not match up with your design data. In the end, this means you’ll have to put more work into your design and basically reverse-engineer a part that was supposed to save you time and effort.
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