Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Kapta Space Raises $24M Series A, Secures Multiple Classified MTI Contracts

10/13/2026 | Kapta Space
Kapta Space, a developer of next-generation spaceborne radar payloads, today announced a $24 million Series A financing led by Washington Harbour Partners and co-led by Bison Ventures, with participation from MetaVC and a group of new and existing investors including MYDA Capital, Entrada Ventures, Aurelia Foundry, and Fitz Gate Ventures.

Indium Expert to Discuss Sintering Technology Standardization at IMAPS Autumn Germany 2026

10/13/2026 | Indium Corporation
Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will discuss his work to develop industry standards for sintering technologies used in electronics and power electronics at IMAPS Autumn Germany 2026, October 15-16, in Munich, Germany.

Kratos, Airbus Complete First European Flight of U740 Valkyrie CCA

10/12/2026 | Globe Newswire
Kratos Defense & Security Solutions, Inc., a technology company in the defense, national security and global markets, and Airbus announced the successful completion of the first flight of the “U740-Valkyrie” in Europe.

Sikorsky Introduces Containerized Nomad 100 VTOL UAS Kit

10/12/2026 | Lockheed Martin
Sikorsky, a Lockheed Martin company, introduced the Nomad 100 fast pack, a containerized vertical takeoff and landing uncrewed aerial system (UAS) kit designed to help customers rapidly deploy autonomous air capability from austere and infrastructure-limited locations.

Global Electronics Association Releases IPC-1783-CO2E Standard for Product Carbon Footprint Data

10/09/2026 | Global Electronics Association
The Global Electronics Association announced the release of IPC-1783-CO2E, International Standard for Data Collection and Reporting of CO2 Equivalent (CO2e) Emissions for the Electronics Manufacturing Supply Chain, a new global standard designed to bring greater consistency, credibility and comparability to product carbon footprint data across the electronics industry.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in