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New Meet the Author Episode Explores Direct Metallization in Advanced PCB Manufacturing

10/28/2026 | I-Connect007
I-Connect007 is pleased to announce the release of its latest Meet the Author podcast episode, featuring Carmichael Gugliotti, Line of Business Director for Primary Metallization at MacDermid Alpha Electronics Solutions and author of The Printed Circuit Designer’s Guide to Direct Metallization: A Guide to Complex PCB Fabrication. As PCB designs become increasingly complex, fabricators face growing pressure to deliver higher performance while reducing process complexity, resource consumption, and waste. Direct metallization, a technology with decades of history, is gaining renewed attention as manufacturers seek more efficient and sustainable approaches to PCB production.

AT&S Announces Early Redemption of 2022 Hybrid Bond

10/12/2026 | AT&S
AT&S will redeem its outstanding 2022 hybrid bond with a nominal amount of €350 million on 22 October 2026, the first available call date.

Indium, SMT Thermal Tech to Demonstrate Low-Temp Reflow Energy Savings

10/05/2026 | Indium Corporation
Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will explore how combining innovative solder materials with optimized reflow oven technology can reduce energy consumption at the Expo for Electronics Manufacturing (EFX), October 6-8, in Stuttgart, Germany.

Micro-Precision Technologies Appoints Kevin Kendrick as VP of Sales

10/05/2026 | BUSINESS WIRE
Micro-Precision Technologies (MPT), a U.S. manufacturer of high-reliability microelectronics for defense and aerospace applications, announced the appointment of Kevin Kendrick as Vice President of Sales.

Micro-Precision Technologies Appoints Kevin Kendrick as Vice President of Sales

10/02/2026 | BUSINESS WIRE
Micro-Precision Technologies (MPT) announced the appointment of Kevin Kendrick as Vice President of Sales. Kendrick will report to Chief Executive Officer Martin Stensgaard and lead MPT’s sales growth strategy, with an emphasis on expanding the company’s hybrid microelectronics business and supporting customers facing increasingly complex obsolescence, lifecycle and modernization challenges.
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