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MKS Inc., a global provider of enabling technologies that transform our world, announced that Dr. Britta Schafsteller, Global Product Manager Semiconductor at MKS’ Atotech, will speak at the upcoming Heterogeneous Integration Global Summit during SEMICON Taiwan. Held at TaiNEX Hall 1 and 2 in Taipei from September 2-4, 2026, the event will bring together industry experts to discuss the latest developments in advanced semiconductor packaging technologies.
These large, copper-filled vias play a critical role as vertical interconnects. They provide low-resistance current paths and enhanced thermal dissipation, which are both essential for high-performance semiconductor packaging. Precise control of copper growth within these vias supports uniform deposition, reduced defect formation and consistent interconnect quality across the wafer. This improves electrical and thermal performance in advanced semiconductor packaging. “As advanced packaging architectures become more complex, semiconductor manufacturers need process solutions that deliver reliability, scalability, and performance at every interconnect level,” said Christian Ohde, General Manager BU SFC, MKS’ Atotech. “At SEMICON Taiwan, we are excited to show how MKS’ Atotech plating innovations help customers address these challenges and enable the next generation of semiconductor devices.”
Alongside the technical program, MKS’ Atotech will showcase its full range of solutions tailored to the diverse needs of next-generation semiconductor manufacturing at booth I2130.
Visit MKS’ Atotech at booth I2130 to explore a broad portfolio of advanced plating solutions tailored to the demands of next-generation semiconductor manufacturing. Highlights include electrolytic processes for pillars, microvias, fine-line RDL, and solder applications in power semiconductors, complemented by a comprehensive offering of tin processes, adhesion promoters, and specialized post-treatments for lead frames.
This year the spotlight is on the following featured Atotech products:
- Everplate® Cu 300 2TF: Deposition of fine-grained metastable Cu enabling direct Cu-to-Cu bond formations
- Everplate® Cu 300 FG: Advanced copper electroplating process enabling direct Cu-to-Cu bonding at ≤200 °C for next-generation semiconductor packaging
- Spherolyte® SnAg2: High-speed process for lead-free, pure and uniform solder bump plating
- Stannolyte® B/ST: Electroless immersion tin plating for semiconductor applications
- Spherolyte® NiFe: All-liquid ECD NiFe electrolyte for barrier plating and electromagnetic shielding
- AgPrep: Ultimate non etching adhesion promoter to achieve MSL1 for leadframe
- Stannopure® PF 10: High-speed, BPA- and PFAS-free tin-plating process with exceptional surface distribution, designed to achieve perfect tin coverage on challenging connector and lead frame types
- Protectostan® Plus 3: Green (PFAS free) postdip for tin to preserve solderability under steam or heat
- ppfPrep: NEAP for pre-plated lead frames assuring excellent adhesion and significant cost savings
- Deflash GR3: Water-based deflashing solution that effectively removes mold flash at lower temperatures, offering an eco-friendly and non-flammable alternative for leadframe surfaces without compromising material integrity
Event: SEMICON Taiwan 2026
Date: September 2-4, 2026
Booth: I2130
Venue: Taipei Nangang Exhibition Center
