Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

CIMS to Exhibit at CPCA 2026 in Shanghai

03/19/2026 | CIMS
CIMS is proud to participate in CPCA 2026, taking place March 24–26, 2026, in Shanghai, China. Visit us at Booth 8J63.

Merlin PCB Group Invests in 2 CIMS Galaxy 25µ AOI Machines

11/13/2025 | Merlin PCB Group
The Merlin PCB group has invested in CIMS Galaxy 25µ AOI machines, one for Merlin Flex in Hartlepool and the other for Merlin Circuit Technology in Hawarden.

United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System

09/11/2025 | United Electronics Corporation
United Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.

CIMS to Exhibit at KPCA Show 2025

08/25/2025 | CIMS
CIMS announced that it will exhibit at KPCA 2025, Korea’s premier annual PCB event, held this year in Incheon.

CIMS to Exhibit at JPCA Show 2025

05/28/2025 | CIMS
CIMS is excited to announce our participation at JPCA 2025 in Tokyo, Japan! Join us from June 4-6.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in