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I-Connect007 Releases Episode 5 of ‘On the Line With… Qnity: Engineering What’s Next’ Podcast Series

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I-Connect007 announces the release of the fifth episode in its six-part podcast series, On the Line With… Qnity: Engineering What’s Next. This latest installment, titled “Engineering Heat Out of High-Power Systems,” examines the increasingly critical role of thermal management in electronics design and how innovative materials are enabling higher performance, greater reliability, and improved safety.

indie Selected for Space-Qualified Satellite Program

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Indium Expert to Explore Factors Driving Performance of Compressible Metal TIMs at TestConX China

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What AI Servers Are Asking of the PCB

10/29/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.
AI infrastructure is pushing PCB performance into new territory. As data rates move from 56 Gbps to 112, 224, 337 Gbps and beyond, the challenge isn't simply building more boards to support growing computing demand. Those boards also have to carry faster signals with less loss, often across increasingly complex, high-layer-count constructions. That puts new pressure on one of the most fundamental parts of the PCB: its materials.
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