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Advanced Electronics Packaging Digest

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Suggested Items

GlobalFoundries, TSMC Agree on U.S. Silicon Interposer Supply for AI Packaging

10/12/2026 | GlobalFoundries
GlobalFoundries (GF) announced a manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC’s CoWoS® advanced packaging ecosystem. Under the agreement, GF will provide manufacturing service to TSMC, and add fabrication capacity at its Malta, New York facility, supporting growing demand for high-performance computing and AI systems.

Koh Young to Unveil AI Inspection Solutions at NEPCON Asia 2026

10/07/2026 | Koh Young Technology
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will unveil its latest inspection platforms and AI-powered process solutions at NEPCON Asia 2026, October 27–29 at the Shenzhen World Exhibition & Convention Center in Shenzhen.

Aismalibar to Showcase Advanced Thermal Management Materials at The Battery Show North America 2026

10/07/2026 | Aismalibar
Aismalibar, a global leader in advanced thermal management materials for electronics and high-power applications, will exhibit at The Battery Show North America 2026, taking place October 12–15 at Huntington Place in Detroit, Michigan.

Qnity Introduces High-Temperature Sealing Solution for Semiconductor Manufacturing

10/06/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced Kalrez® 7080 perfluoroelastomer parts, a high-performance sealing solution engineered for semiconductor processes operating at temperatures up to 330°C.

MKS' Atotech to Showcase Semiconductor Solutions at SEDEX 2026

10/05/2026 | MKS Inc.
MKS Inc. , a global provider of enabling technologies that transform our world, announced that its strategic brand Atotech, offering process chemicals, equipment, software, and services, will exhibit at SEDEX 2026, taking place October 14-16, 2026, in Seoul, South Korea.
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