Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Qnity Introduces High-Temperature Sealing Solution for Semiconductor Manufacturing

10/06/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced Kalrez® 7080 perfluoroelastomer parts, a high-performance sealing solution engineered for semiconductor processes operating at temperatures up to 330°C.

MKS' Atotech to Showcase Semiconductor Solutions at SEDEX 2026

10/05/2026 | MKS Inc.
MKS Inc. , a global provider of enabling technologies that transform our world, announced that its strategic brand Atotech, offering process chemicals, equipment, software, and services, will exhibit at SEDEX 2026, taking place October 14-16, 2026, in Seoul, South Korea.

Real Time with... THECA 2026: DTECH Advances PCB Drilling for AI and High-Speed Systems

09/25/2026 | Real Time with... THECA
Sheryl Zheng, marketing manager at DTECH, discusses how AI and high-speed communications are reshaping PCB drilling requirements. She explains DTECH's evolution from a PCB tool specialist into a broader solutions provider and why drill-bit performance is becoming a more critical element of producing advanced, high-quality circuit boards.

Latest Episode of Qnity Podcast Series Explores Materials for Mission-Critical Reliability

09/25/2026 | I-Connect007
The second episode of Engineering What’s Next, a podcast series from Qnity, is now available on I-Connect007. The series explores the materials, technologies, and expertise shaping the next generation of electronics. In “Materials for Mission-Critical Reliability,” host Marcy LaRont speaks with Rich Wessel, Industrial Application Leader, Laminates, about the increasingly complex demands placed on materials as electronics move into more challenging and mission-critical applications.

GlobalFoundries, Marvell Expand Collaboration for Next-generation Optical Connectivity

09/18/2026 | GlobalFoundries
GlobalFoundries (GF) and Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced an expanded multi-year agreement to increase capacity for GF’s silicon germanium (SiGe) technology at its Burlington, Vermont, facility to support growing demand for next-generation optical connectivity.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in