Indium Expert to Present AI Packaging and High-Power Consumption Solutions at SEMICON Taiwan

Estimated reading time: 1 minute

Indium Corporation® Senior Area Technical Manager Jason Chou will discuss solutions designed to address the high-power consumption and complex packaging challenges of AI applications, from integrated circuits to full system assembly, at SEMICON Taiwan, September 2-4, in Taipei, Taiwan.

The presentation, titled Material Solutions for AI Industry from Packaging to System Assembly, introduces specialized materials designed to overcome these challenges and support better AI performance. Solutions presented include high-performance flux materials for microbump wafer bumping and Chip-on-Wafer (CoW) processes. Also highlighted are mid-temperature solder pastes developed to eliminate Head-in-Pillow (HiP) and Non-Wet-Open (NWO) defects, as well as high-performance thermal interface materials (TIMs) designed to significantly enhance the thermal efficiency of high-performance computing chips.

Jason Chou is a senior area technical manager based at Indium Corporation’s Taiwan facility. In this role, he provides technical support to Indium Corporation’s customers focusing on the semiconductor industry. His strategic location in southern Taiwan enables timely customer response, as well as efficient sales and marketing team support. He holds a bachelor’s degree in chemistry from National Cheng Kung University, Taiwan, and a master’s degree in chemistry from National Tsing Hua University, Taiwan.

SEMICON Taiwan visitors can attend Chou’s presentation on September 4, 13:20-13:40 CST. To learn more about Indium Corporation’s TIMs and HPC materials solutions, visit indium.com or meet with our experts at SEMICON Taiwan, Booth 12416.