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Advanced Electronics Packaging Digest

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Quantinuum, RIKEN Expand Quantum-AI Partnership in Japan

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Quantinuum and RIKEN Expand Partnership to Accelerate the Commercialization of Quantum-AI Hybrid Supercomputing in Japan

Foxconn Showcases Pearl Satellites and Communications Technologies at TASTI 2026

11/09/2026 | Foxconn
Foxconn Technology Group is showcasing its latest developments in next-generation satellite communications at the Taiwan International Assembly of Space Science, Technology, and Industry (TASTI 2026), held November 8-10 at the Greater Tainan Convention and Exhibition Center.

Nordson EFD to Preview New Dispensing Technologies for Medical Device Assembly at COMPAMED 2026

11/06/2026 | Nordson
Nordson EFD, a Nordson company, announced that trade show attendees will get the first look at two new dispensing technologies, the Ultimus AccuFlow™ and PICO Pµlse® XP HV, at COMPAMED 2026, November 16–19 at the Düsseldorf Exhibition Centre in Düsseldorf, Germany.

Curtiss-Wright Wins $225M+ in U.S. Navy Contracts

11/06/2026 | BUSINESS WIRE
Curtiss-Wright Corporation announced it was awarded contracts valued in excess of $225 million by Bechtel Plant Machinery, Inc. (BPMI) to provide advanced propulsion valves, pumps and instrumentation and control systems for the U.S. Navy’s Virginia-class nuclear powered attack submarine, Columbia-class submarine and Ford-class aircraft carrier programs.

Curtiss-Wright Invests $30M to Expand Texas Operations

11/03/2026 | Curtiss-Wright Corporation
Curtiss-Wright Corporation announced a $30 million capital investment to expand operations at its Round Rock, Texas facility, to strengthen its manufacturing capabilities in support of critical nuclear energy and industrial applications.
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