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BEST Inc., a leader in electronic component and PC services, is pleased to announce they offer interposer rework and precision solder ball attachment services. Interposer rework is an advanced process used to repair, replace, or modify the interposer that connects critical electronic components within high density assemblies. This specialized service helps restore functionality, improve reliability, and extend the life of valuable electronic hardware without the expense of replacing the entire assembly. Solder ball attachment is used for attaching solder balls to BGA, CSP and wafer level packages.
The most common reasons for using an interposer include repairing torn or missing PCB pads that cannot be repaired conventionally, damaged internal PCB vias near the component footprint, engineering change orders (ECOs) that require rerouting signals, repairing lifted pads without replacing an expensive multilayer PCB, or recovering high-value equipment where board replacement is impractical.
The significant advantages of using an interposer are it can save an expensive board from being scrapped, it can avoid replacing complex multilayer PCBs, and it allows re-routing of damaged or inaccessible connections. An additional advantage is that an interposer is extremely useful for prototype modifications and engineering changes.
Precision solder ball attachment services are available from BEST Inc. for printed circuit board assemblies, surrogates or interposers. First-time solder ball attachment for bare substrates and specialty assemblies provide uniform ball placement and are available for prototype to full production capability with X-ray verification available.
BEST Inc. offers professional interposer rework services performed by experienced technicians using precision equipment and proven techniques. Whether you need to recover high value components, correct manufacturing issues, or support engineering changes, our team has the expertise to deliver dependable results with the quality and attention to detail you expect.
