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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Microchip Technology Acquires VORAGO Technologies

10/09/2026 | Globe Newswire
Microchip Technology Incorporated, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions, announced that it has acquired VORAGO Technologies, Inc., a privately held provider of radiation-hardened and radiation-tolerant microcontrollers (MCUs) and microprocessors (MPUs), based in Austin, Texas.

Global Electronics Association, Purdue University Establish Strategic Partnership to Advance Electronics Innovation

10/09/2026 | Global Electronics Association
The Global Electronics Association and Purdue University have signed a memorandum of understanding establishing a strategic partnership to advance innovation, workforce development and industry collaboration across the electronics ecosystem.

Incap Germany welcomes Bavarian Minister at InnoTrans 2026

10/09/2026 | Incap
Incap Germany welcomed Bavaria’s Minister for Housing, Construction and Transport during InnoTrans 2026 in Berlin.

Six Suppliers Bet on VCSEL NPO as Demand Hits 650 Million Units by 2031

10/09/2026 | TrendForce
TrendForce’s latest report, “2027 Infrared Sensing and Optical Communication Market Trend”, shows that rapidly growing demand for data transmission in expanding data center networks is increasing interest in VCSEL-based near-packaged optics (NPO).

Applied Materials, Intel Collaborate on AI Chipmaking Innovations

10/08/2026 | Globe Newswire
Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, announced it is working with Intel Corporation to accelerate development of chipmaking innovations for next-generation transistors, interconnects and advanced packaging technologies.
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